Valens and STMicroelectronics announced last week their collaboration to bring HDBaseT Automotive into connected cars. The highly efficient technology optimizes in-vehicle connectivity by enabling the transmission of reliable 6Gbps high-throughput infotainment, road safety, and automotive-control content over a low-cost infrastructure with near-zero latency.
Valens, as the inventor of HDBaseT and founder of the HDBaseT Alliance, brings the technology and expertise to accomplish the goal of commercializing HDBaseT-enabled vehicles. STMicroelectronics will contribute its extensive design and manufacturing experience and know-how in compliance with the strict automotive quality and reliability requirements.
In January, Israeli chip producer Valnes Semiconductors made a bold move, announcing its intentions to enter automotive tech. In the ConCarExpo 2016 held in Düsseldorf, the developer of HDBase Technology unveiled its first automotive silicon – the VA600T, the first silicon to demonstrate the transmission of high-throughput, time-sensitive applications over an HDBaseT Automotive link.
Since its announcement in January, Valnes has developed its HDBaseT Automotive , a technology that enables up to 6Gbs tunneling of audio, video, data, USB and more, with native networking capabilities over a single unshielded twisted-pair (UTP) cable for up to 15m (50ft), targeting the existing 100BASE-T1 comparable channel utilized today in the automotive sector. The VA600T illustrates the clear benefits brought by HDBaseT Automotive, including high-bandwidth, top performance, feature-rich capabilities, and near-zero latency transmission, through a highly robust and EMC-resistant solution.
Genva, Switzerland based STMicroelectronics is Europe’s leading semiconductor producer. The company producing chips and components in various fields, from IoT applications to smart cars. The company is traded according to a market cap of $7.9 billion. In Q3 2016, the company’s revenues totaled $1.9 billion.
Helping cars lose weight
“As Valens meets significant milestones in our vision to optimize in-vehicle connectivity, we are excited to welcome ST as our major partner in pursuing this goal. ST will help us accelerate the introduction of HDBaseT Automotive to the market,” said Dror Jerushalmi, CEO, Valens.
One of the main advanteges of Valnes’s technology is the reduction of the volume of automotive wiring. An average car has some 150kg of wires. The automotive industry is constantly on the search for means to reduce car weight, and the reduction of up to 150 kg is centennially a lucrative selling point for the Israeli company’s technology.